Board Support Package
Mobica has extensive experience developing complete board support packages, and components included in or augmenting them. The low-level team has developed and integrated BSP components for all major mobile operating systems, and for all major silicon vendors (including TI OMAP, ST-Ericsson, Qualcomm, NXP, Intel, Freescale, Siemens, Hitachi, Samsung). Mobica's base porting team includes some of the the most experienced engineers in Europe.
Specific examples of Mobica BSP project work includes:
- Development of Android power management components
- Development of Linux graphics acceleration device drivers
- Enhancement of Windows Mobile camera device drivers
- Development of Symbian/UIQ USB host device drivers
- Development of entire S60 base