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Board Support Package

Board Support Package

Mobica has extensive experience developing complete board support packages, and components included in or augmenting them. The low-level team has developed and integrated BSP components for all major mobile operating systems, and for all major silicon vendors (including TI OMAP, ST-Ericsson, Qualcomm, NXP, Intel, Freescale, Siemens, Hitachi, Samsung). Mobica's base porting team includes some of the the most experienced engineers in Europe.

Specific examples of Mobica BSP project work includes:

  • Development of Android power management components
  • Development of Linux graphics acceleration device drivers
  • Enhancement of Windows Mobile camera device drivers
  • Development of Symbian/UIQ USB host device drivers
  • Development of entire S60 base
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